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AA-BOND 2112 Rigid Epoxy Staking Compound, 2 Part, Medium Visc, Room Temp or Heat Cure

AA-BOND 2112 Rigid Epoxy Staking Compound, 2 Part, Medium Visc, Room Temp or Heat Cure
Product Code: AA-BOND 2112
Availability: In Stock
This product has a minimum quantity of 1

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Technical Product Bulletin



AA-BOND 2112 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-sag characteristics.

AA-BOND 2112 solvent-free adhesive is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications involving metals, glass, ceramics, wood and many plastics.

AA-BOND 2112 hardens to a tough, enamel-like coating offering good chemical resistance as well as superior physical and mechanical properties. The cured adhesive provides good electrical insulation and resistance to weather, galvanic action, petroleum products and lubricants, alcohol, salts, mild acids and alkalis, and other organic and inorganic compounds.


Appearance Milky translucent
Cure Type Room temperature or Heat Cure
Benefits Tough enamel like cure
Bonds variety of substrates
Good electrical insulation
Weather resistant
Mix Ratio by weight 100:22 / Resin:Hardener
Substrates Metals, glass, ceramics, wood and many plastics
Operating Temperature -60 to 125 °C
Typical Applications Printed circuit board repair, staking components, bonding, laminating and repair applications


Viscosity @ 25 °C, mPa∙s (cP) 60000 cPs
Thixotropic Index 6.5
Specific Gravity, mixed 1.2
Reactive solids contents, % 100
Pot Life 30 minutes


4 hours @ 65°C
24 hours @ 25°C


Volume Resistivity 6.00e+13 ohm-cm
Dielectric Constant 4.6
Dielectric Strength 16.1 kV/in
CTE, linear 55.0 µm/m-°C@ Temperature 20.0 °C
Glass Transition Temp, Tg 93 °C
Hardness, Shore D 90
Lap shear 1900 psi (Alum to Alum)


For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).


1) Carefully clean and dry all surfaces to be bonded.

2) Apply the mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.

3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.

4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.


This epoxy can be supplied in various different packages.

Data Sheets: TDS | MSDS available upon request.

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