Potting and Encapsulation
AA-BOND 2110 is a thixotrpoic epoxy resin and hardener formulation developed for industrial adhesive, staking, laminating, repar and manufacturing applications.
AA-BOND 2112 is a thixotropic rigid epoxy system recommended for critical eletronic, aerospace and industrial bonding, laminating and reinforcing applications.
AA-BOND-BK 2112 is a thixotropic rigid epoxy system recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications.
AA-BOND 2113 is a clear epoxy adhesive, that contains no solvents, cures at room temp, and adheres strongly to glass, ceramics, most metals and many plastics.
AA-BOND 2116 is a thixotropic, low vapor pressure epoxy system recommended for critical electronic, aerospace, and industrial applications.
AA-BOND 2153 is a thixotropic is a electrically insulating and thermally conductive epoxy system used in staking transistors, diodes, resistors, and other heat sensitive components.
AA-BOND 2156 is a thixotropic thermally conductive epoxy system used for staking heat sinks, transistors, diodes, circuits and other heat senstive components.
Masterbond EP30AN, EP30AN, EP30AN-1, AA-BOND EP30AN.
AA-CAST 156 is an easy-to-use, low cost, versatile epoxy resin and hardener system developed for general purpose casting applications. It develops excellent adhesion to most metals, plastics, and ceramics, and is recommended for electrical and structural
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