AA-BOND FDA8 EPOXY ADHESIVE is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administration (FDA) Chapter 1, Sub Part B, Sections 175.105 and 175.300.
Heat cure or Room Temperature
effective electrical insulator
low permeability to gasses and vapors
Mix Ratio by weight
100:100 / Resin: Hardener
FDA Grade Applications, food packaging, indirect contact with food and medical applications
Viscosity @ 25 °C, cps
1,500 (After Mixing)
@ temperature 77.0 °F, 25.0 °C
Specific Gravity, mixed
Reactive solids contents, %
Hardness, Shore D
Dielectric strength volts/mil
3.35 @ frequency 1000 Hz
-70 to 145 °C
29.4 µin/in-°F @ temperature 68.0 °F
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1) Carefully clean and dry all surfaces to be bonded.
2) Apply AA-BOND FDA8 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
This epoxy can be supplied in various different packages.