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AA-DUCT CG2 Low Cost, Silver Coated Glass Sphere, Electrically Conductive, Epoxy Adhesive

AA-DUCT CG2 Low Cost, Silver Coated Glass Sphere, Electrically Conductive, Epoxy Adhesive
Product Code: AA-DUCT CG2
Availability: In Stock
This product has a minimum quantity of 1


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Technical Product Bulletin

ELECTRICALLY CONDUCTIVE ONE PART LOW COST EPOXY


PRODUCT DESCRIPTION:

AA-DUCT CG2 is a single component epoxy, formulated with silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulation. This concept opens the door to a wide range of applications previously prohibited by the much higher cost of Conventional silver conductive.

AA-DUCT CG2 Formulated with Silver coated ceramic power combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive substrates.

AA-DUCT CG2 formulation produces electrically conductive paths on a wide variety of surfaces including plastics, rubber, cloth, thermoplastic, paper, wood and many others.

AA-DUCT CG2 designed for use in diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, static shielding, connections, and circuitry.

PHYSICAL PROPERTIES:

Appearance Silver Coated ceramic
Cure Type Heat cure
Viscosity 6,800
Benefits High strength
Perfect bond
EMI & RFI shielding
Wave guides
Substrates Excellent choice for the Integrated Circuits, aluminum, copper, magnesium,steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
Catalyst Anhydride
Typical Application diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, static shielding, connections, and circuitry.

CURED PROPERTIES:

Sheet Resistivity <0.1 Ω/sqcm
Lap shear strength 2000 Lb/in2 (1400 N/cm2)
Adhesion Tensile Strength 1000 N/cm2 (1500 lb/in2)
Thermal Conductivity 0.04J/(cm.s. °C) [0.01cal/(cm.s. °C)]
Specific heat 0.30J/(g. °C) :[0.07 cal/g. °C]
Coefficient of Thermal Expansion 3x10-5 (m/m)/ °C
Modulus of elasticity 4x1010 Pa (6x105 lb/in2)

CURE SCHEDULE:

0.7 hours @ 200°C, 392°F
1.5 hours @ 180°C, 356°F
2.5 hours @ 160°C, 320°F

GENERAL INFORMATION:

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

HOW TO USE:

1) Carefully clean and dry all surfaces to be bonded.

2) Apply AA-DUCT CG2 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.

3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.

4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.

AVAILABILITY:

This epoxy can be supplied in various different packages.

Data Sheets: TDS | MSDS available upon request.


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