SINGLE COMPONENT, MICROELECTRONIC CONDUCTIVE EPOXY ADHESIVE
AA-DUCT 2979 is a fast curing one part epoxy adhesive with superior electrical conductivity and bonding capability.
AA-DUCT 2979 has been shown to retain their properties through hundreds of hours of rapid temperature cycling and has also high impact absorption and stress resistance.
Excellent mechanical, electrical properties
Excellent choice for Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
-40°C to 175 °C
Applications where high impact absorption and stress resistance is required
Viscosity @ 25 °C cps
65,000 @ Temperature 77.0 °F
Adhesive Bond Strength
Thermal Conductivity, W/m.K
Coefficient of Thermal Expansion
57x 10^-6 (in/in) °C
Lap Shear Strength, PSI
Hardness, Shore D
Volume Resistivity ohm-cm
3 x 10-4
Glass Transition Temp, Tg
45.0 °C, 113 °F
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1) Carefully clean and dry all surfaces to be bonded.
2) Apply AA-DUCT 2979 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
This epoxy can be supplied in various different packages.