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AA-BOND G298 Gold Epoxy Adhesive, 2 Part, Electrically and Thermally Conductive

AA-BOND G298 Gold Epoxy Adhesive, 2 Part, Electrically and Thermally Conductive
Product Code: AA-BOND G298
Availability: In Stock
This product has a minimum quantity of 1


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Technical Product Bulletin

GOLD EPOXY ADHESIVE


PRODUCT DESCRIPTION:

AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.

GENERAL PROPERTIES

Components A & B
Appearance Brown
Cure Type Room temperature or Heat cure
Benefits Gold filled epoxy allows for anti-oxidation of contacts and terminals in high reliability devices.
It can be used in medical circuits using traditional hybrid packaging technologies.
High viscosity paste allows for precision deposition onto circuits by means of printing and delicate hand processes.
Mix Ratio by weight 100:4 / Resin:Hardener
Substrates Metals, ceramics, glass, glass fabrics, wood leather and rigid plastics
Operating Temperature Continuous: - 55°C to 275°C
Intermittent: - 55°C to 375°C
Typical Applications Adhesive for joining die and SMDs onto the hybrid circuits
Repairing defective Au thick-film conductor traces and contact pads
Resisting oxidation and electro-migration in high-reliability micro-electronics
Joining material as alternative to high temperature Au-Sn eutectic solders processes exceeding 300°C

UNCURED PROPERTIES:

Viscosity @ 25 °C, mPa∙s (cP) Paste
Pot Life 30 mins
Shelf Life 1 Year

CURE SCHEDULE:

15 minutes @ 120°C
90 minutes @ 80°C
10 hours @ 50°C
24 hours @ 25°C

MISC PROPERTIES:

Volume Resistivity @ 23°C: ≤ 0.0009 Ohm-cm
Glass Transition Temp, Tg ≥ 100°C (Dynamic Cure
20—200°C /ISO 25 Min; Ramp-
10—200°C @ 20°C/Min)
Die Shear Strength @ 23°C: ≥ 5 Kg / 1,700 psi

GENERAL INFORMATION:

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

HOW TO USE:

1) Carefully clean and dry all surfaces to be bonded.

2) Apply AA-BOND G298 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.

3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.

4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.

AVAILABILITY:

This epoxy can be supplied in various different packages.

Data Sheets: TDS | MSDS available upon request.


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