AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.
A & B
Room temperature or Heat cure
Gold filled epoxy allows for anti-oxidation of contacts and terminals in high reliability devices.
It can be used in medical circuits using traditional hybrid packaging technologies.
High viscosity paste allows for precision deposition onto circuits by means of printing and delicate hand processes.
Mix Ratio by weight
100:4 / Resin:Hardener
Metals, ceramics, glass, glass fabrics, wood leather and rigid plastics
Continuous: - 55°C to 275°C
Intermittent: - 55°C to 375°C
Adhesive for joining die and SMDs onto the hybrid circuits
Repairing defective Au thick-film conductor traces and contact pads
Resisting oxidation and electro-migration in high-reliability micro-electronics
Joining material as alternative to high temperature Au-Sn eutectic solders processes exceeding 300°C
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1) Carefully clean and dry all surfaces to be bonded.
2) Apply AA-BOND G298 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
This epoxy can be supplied in various different packages.