AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive components to printed circuit boards.
AA-BOND 2156 is two parts fast cure adhesive develops strong bond to many materials, and its coefficient of thermal expansion provides a good match for the application.
Heat cure or Room Temperature
High-impact bonds at room temperature
Mix Ratio by weight
100:23 / Resin:Hardener
Bonds readily to itself and to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics and to many other materials
Fiber optic bundles, potting glas fibers and fiber optic connectors
Viscosity @ 25 °C
12,000 ±1000 (After Mixing) @ Temperature 77.0 °F, 25°C
Specific Gravity, mixed
Reactive solids contents, %
Glass transition temperature (Tg),
Lap shear strength, psi
3400 (Alum to Alum)
-40 to 100 °C
@Temperature 68.0 °F
Hardness, Shore D
Adhesive Bond Strength
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1) Carefully clean and dry all surfaces to be bonded.
2) Apply the AA-BOND 2156 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
This epoxy can be supplied in various different packages.