AA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.
AA-BOND 2153 is two parts adhesive develops strong, durable, high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation.
AA-BOND 2153 bonds to itself and to metals, silica, alumina, others ceramics, glass, plastics and many other materials.
AA-BOND 2153 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals.
Heat cure or Room Temperature
High impact bonds at room temperature
Mix Ratio by weight
100:7 / Resin: Hardener
Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards
Specific Gravity, mixed
Reactive solids contents, %
10.0 µin/in-°F @ Temperature 68.0 °F
Glass transition temperature (Tg), °C
110 °C, 230 °F
-70 to 110 °C / -94 to 230 °F
Hardness, Shore D
Dielectric strength, volts/mil
2 – 4 Hours
4.00e+13 ohm-cm @ Temperature 212 °F
6.0 @ Frequency 1000 Hz
0.010 @ Frequency 1000 Hz
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1) Carefully clean and dry all surfaces to be bonded.
2) Apply AA-BOND 2153 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best result.
This epoxy can be supplied in various different packages.