AA-BOND 2116 is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronics, aerospace, and industrial applications where a high-fill, non-sag reliable adhesive is required for bonding and enhancing the mechanical and structural rigidity of assemblies.
AA-BOND 2116 is two-part, solvent-free compound is readily mixed, handled, used, and cured at room temperature, and develops strong bonds to most clean, dry material surfaces including metals, glass, ceramics, wood and many plastics.
AA-BOND 2116 bonds provide electrical insulation and excellent resistance to weather, galvanic action, petroleum solvents and lubricants, gasoline, jet fuels, alcohol, salts, and mild acids and alkalis.
Ceramics, glass to glass, fabrics, metals, laminates and other composite materials
-60 to 130 °C
critical electronics, aerospace, and industrial applications where a high-fill, non-sag reliable adhesive is required for bonding and enhancing the mechanical and structural rigidity of assemblies
Reactive solids contents, %
Hardness, Shore D
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1) Carefully clean and dry all surfaces to be bonded.
2) Apply this completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
This epoxy can be supplied in various different packages.