AA-BOND 350 Thermally Conductive, 1 Part Epoy E 3503-1 Replacement
Product Code: | AA-BOND 350 |
Availability: | In Stock |
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Product Code: | AA-BOND 350 |
Availability: | In Stock |
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Data Sheets:TDS| MSDS:available upon request.
PRODUCT DESCRIPTION: AA-BOND 350 is a solvent-free, one-part epoxy adhesive recommended for SMT and SMD (Surface Mount Device) bonding and sealing applications where it is easy handling, high strength and superior electrical insulation features are required. This smooth paste adhesive can be dispensed pneumatically, or by screen or pin transfer without stringing or tailing, and can position components before cure. This product is an offset to Loctite Ablestik E 3503. AA-BOND 350 has a six months shelf life and develops strong, durable, solvent-resistant bonds - after a required high temperature cure cycle - to and between many different materials such as semiconductors, ceramics, glass, metals, and laminates. It is ideal for bonding chip-on-board, active and/or passive chip-type components in the fabrication of printed, integrated and hybrid circuits, and is just right for screen printing and epoxy die mounting applications, or for the assembly and repair of printed circuits, wave guides and electrical modules. The cured resin has excellent moisture and chemical resistance. GENERAL PROPERTIES:
UNCURED PROPERTIES:
THERMAL PROPERTIES:
|
CURED PROPERTIES:
Hardness, Shore D |
87 |
Operating Temperature |
-145°C to 125°C |
CURE SCHEDULE:
15-30 Minutes depending of the amount used. |
@ 120°C |
5 minutes |
@ 150°C |
PHYSICAL PROPERTIES:
Tensile Strength, psi |
7,500 |
Glass transition°C |
95 |
Dielectric Strength |
500volts/mil |
GENERAL INFORMATION:
For safe handling information on this product, consult the Safety Data Sheet (SDS).
HOW TO USE:
Storage:
AA-BOND 350 should be stored at frozen temperature. Keeping the product at room temperature will reduce shelf life to 1 week.
AVAILABILITY:
This epoxy can be supplied in many different packages.